化學成分 PSMN045-100HL

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665471115	PSMN045-100HLX	PSMN045-100HL	SOT1205 (LFPAK56D)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 57812 ppm of the article. SCIP No. 41343284-f900-47cb-8264-bf9d6ed282fd.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 7114 ppm; substance 1333-86-4: 1067 ppm; substance 7439-92-1: 57813 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 7824 ppm; substance 1309-64-4: 7113 ppm; substance 1333-86-4: 1066 ppm; substance 7439-92-1: 57812 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1563 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	2.800000	100.000000	3.054768
		Die Total		2.800000	100.000000	3.054768

Clip	Copper alloy	Copper (Cu)	7440-50-8	13.173600	99.800000	14.372245
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.019800	0.150000	0.021601
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.006600	0.050000	0.007201
		Clip Total		13.200000	100.000000	14.401047

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	35.329200	99.800000	38.543749
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.053100	0.150000	0.057932
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.017700	0.050000	0.019310
		Lead Frame Total		35.400000	100.000000	38.620991

Mould Compound	Filler	Silica fused	60676-86-0	23.472000	72.000000	25.607681
Mould Compound	Filler	Silica -amorphous-	7631-86-9	2.053800	6.300000	2.240672
Mould Compound	Polymer	Epoxy resin system		1.956000	6.000000	2.133973
Mould Compound	Additive	Non hazardous		1.890800	5.800000	2.062841
Mould Compound	Polymer	Phenol Formaldehyde resin (generic)	9003-35-4	1.760400	5.400000	1.920576
Mould Compound	Polymer	Bromophenol/Formaldehyde/Epichlorohydrin polymer	68541-56-0	0.717200	2.200000	0.782457
Mould Compound	Flame retardant	Antimony Trioxide (Sb2O3)	1309-64-4	0.652000	2.000000	0.711324
Mould Compound	Pigment	Carbon black	1333-86-4	0.097800	0.300000	0.106699
		Mould Compound Total		32.600000	100.000000	35.566223

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	1.929807	99.990000	2.105397
Post-Plating	Impurity	Non hazardous		0.000193	0.010000	0.000211
		Post-Plating Total		1.930000	100.000000	2.105608

Solder Paste 1	Lead alloy	Lead (Pb)	7439-92-1	3.578589	92.470000	3.904199
Solder Paste 1	Lead alloy	Tin (Sn)	7440-31-5	0.193500	5.000000	0.211106
Solder Paste 1	Lead alloy	Silver (Ag)	7440-22-4	0.096750	2.500000	0.105553
Solder Paste 1	Impurity	Antimony (Sb)	7440-36-0	0.001161	0.030000	0.001267
		Solder Paste Total		3.870000	100.000000	4.222125
		Solder Paste 1 Total		3.870000	100.000000	4.222125

Solder Paste 2	Lead alloy	Lead (Pb)	7439-92-1	1.720500	92.500000	1.877045
Solder Paste 2	Lead alloy	Tin (Sn)	7440-31-5	0.093000	5.000000	0.101462
Solder Paste 2	Lead alloy	Silver (Ag)	7440-22-4	0.046500	2.500000	0.050731
		Solder Paste Total		1.860000	100.000000	2.029238
		Solder Paste 2 Total		1.860000	100.000000	2.029238

		PSMN045-100HL Total		91.660000	100.000000	100.000000

Notes
Report created on 2024-11-20 08:39:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-11-20 08:39:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏1 (Solder Paste 1)	?	?	?	?	?	?
錫膏2 (Solder Paste 2)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-11-20 08:39:48 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 PSMN045-100HL

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 PSMN045-100HL

ESD保護、TVS、濾波和信號調節(jié)ESD保護