12NC | OPN | Type No. | Package | State | MSL |
---|---|---|---|---|---|
934067543118 | PSMN7R6-100BSEJ | PSMN7R6-100BSE | SOT404 (D2PAK) | RFS | 1 |
REACH | Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 6288 ppm of the article. SCIP No. f418fbbb-02c3-4537-b339-5fe68689b4f8. |
EU RoHS | Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'. |
CN RoHS | Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS). |
ELV | Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'. |
PFAS | Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS). |
CA Proposition 65 | Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 6289 ppm; substance 7440-02-0: 3968 ppm; substance 1309-64-4: 7106 ppm; substance 1333-86-4: 790 ppm; |
IEC 62474 | Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 6288 ppm; substance 7440-02-0: 3967 ppm; substance 1309-64-4: 7105 ppm; substance 40039-93-8: 5921 ppm; substance 1333-86-4: 789 ppm; |
Precious Metals | Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 101 ppm; |
RHF Indicator | Contains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition. |
Material | Material Group | Substance | CAS No. | Mass (mg) | Material (%) | Product (%) |
---|---|---|---|---|---|---|
Solder Wire | Lead alloy | Lead (Pb) | 7439-92-1 | 9.088200 | 93.500000 | 0.628830 |
Solder Wire | Lead alloy | Tin (Sn) | 7440-31-5 | 0.486000 | 5.000000 | 0.033627 |
Solder Wire | Lead alloy | Silver (Ag) | 7440-22-4 | 0.145800 | 1.500000 | 0.010088 |
Solder Wire Total | 9.720000 | 100.000000 | 0.672545 | |||
Die | Doped silicon | Silicon (Si) | 7440-21-3 | 7.900000 | 100.000000 | 0.546616 |
Die Total | 7.900000 | 100.000000 | 0.546616 | |||
Lead Frame | Copper alloy | Copper (Cu) | 7440-50-8 | 822.509979 | 98.970000 | 56.911030 |
Lead Frame | Copper alloy | Nickel (Ni) | 7440-02-0 | 5.734383 | 0.690000 | 0.396773 |
Lead Frame | Copper alloy | Phosphorus (P) | 7723-14-0 | 1.994568 | 0.240000 | 0.138008 |
Lead Frame | Copper alloy | Iron (Fe) | 7439-89-6 | 0.831070 | 0.100000 | 0.057503 |
Lead Frame Total | 831.070000 | 100.000000 | 57.503314 | |||
Mould Compound | Filler | Silica fused | 60676-86-0 | 427.890000 | 75.000000 | 29.606523 |
Mould Compound | Polymer | Epoxy resin system | 81.774514 | 14.333330 | 5.658134 | |
Mould Compound | Polymer | Phenolic resin | 40.887286 | 7.166670 | 2.829069 | |
Mould Compound | Flame retardant | Antimony Trioxide (Sb2O3) | 1309-64-4 | 10.269360 | 1.800000 | 0.710557 |
Mould Compound | Flame retardant | Tetrabromobisphenol A/Epichlorohydrin polymer | 40039-93-8 | 8.557800 | 1.500000 | 0.592130 |
Mould Compound | Pigment | Carbon black | 1333-86-4 | 1.141040 | 0.200000 | 0.078951 |
Mould Compound Total | 570.520000 | 100.000000 | 39.475364 | |||
Post-Plating | Tin alloy | Tin (Sn) | 7440-31-5 | 19.788021 | 99.990000 | 1.369171 |
Post-Plating | Impurity | Non hazardous | 0.001979 | 0.010000 | 0.000137 | |
Post-Plating Total | 19.790000 | 100.000000 | 1.369308 | |||
Wire 1 | Pure metal | Aluminium (Al) | 7429-90-5 | 6.000110 | 99.990000 | 0.415158 |
Wire 1 | Impurity | Non hazardous | 0.000600 | 0.010000 | 0.000042 | |
Wire Total | 6.000710 | 100.000000 | 0.415200 | |||
Wire 1 Total | 6.000710 | 100.000000 | 0.415200 | |||
Wire 2 | Pure metal | Aluminium (Al) | 7429-90-5 | 0.255106 | 99.990000 | 0.017651 |
Wire 2 | Impurity | Non hazardous | 0.000026 | 0.010000 | 0.000002 | |
Wire Total | 0.255132 | 100.000000 | 0.017653 | |||
Wire 2 Total | 0.255132 | 100.000000 | 0.017653 | |||
PSMN7R6-100BSE Total | 1445.255842 | 100.000000 | 100.000000 |
Notes |
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Report created on 2024-11-20 08:40:02 CET+0100 |
Disclaimer |
---|
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
Pb-free Soldering | Pb Soldering | No. of Processing Cycles | ||
---|---|---|---|---|
PPT | MPPT | PPT | MPPT | |
245 °C | 40 s | 220 °C | 30 s | 3 |
Notes |
---|
Report created on 2024-11-20 08:40:02 CET+0100 |
Disclaimer |
---|
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |
部件名稱 Material |
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements) | |||||
---|---|---|---|---|---|---|
鉛 (Pb) | 鎘 (Cd) | 汞 (Hg) | 六價(jià)鉻 (Cr6+) | 多溴聯(lián)苯 (PBB) | 多溴二苯醚 (PBDE) | |
焊錫絲 (Solder Wire) | ? | ? | ? | ? | ? | ? |
半導(dǎo)體芯片 (Die) | ? | ? | ? | ? | ? | ? |
引線框架 (Lead Frame) | ? | ? | ? | ? | ? | ? |
模封料 (Mould Compound) | ? | ? | ? | ? | ? | ? |
后鍍層 (Post-Plating) | ? | ? | ? | ? | ? | ? |
導(dǎo)線1 (Wire 1) | ? | ? | ? | ? | ? | ? |
導(dǎo)線2 (Wire 2) | ? | ? | ? | ? | ? | ? |
? | 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572. |
? | 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572. |
? |
該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。 This semiconductor product has an indefinite environmental friendly use period (EFUP). |
Notes |
---|
Report created on 2024-11-20 08:40:02 CET+0100 |
Disclaimer |
---|
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights. |