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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PSMN8R0-40HL

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司,安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息,恩智浦可以向我們的客戶提供相關(guān)資料,以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估??蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù),這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC OPN Type No. Package State MSL
934665397115PSMN8R0-40HLXPSMN8R0-40HLSOT1205 (LFPAK56D)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 57812 ppm of the article. SCIP No. 41343284-f900-47cb-8264-bf9d6ed282fd.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 7114 ppm; substance 1333-86-4: 1067 ppm; substance 7439-92-1: 57813 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 7824 ppm; substance 1309-64-4: 7113 ppm; substance 1333-86-4: 1066 ppm; substance 7439-92-1: 57812 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1563 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-32.800000100.0000003.054768
Die Total2.800000100.0000003.054768
ClipCopper alloyCopper (Cu)7440-50-813.17360099.80000014.372245
ClipCopper alloyIron (Fe)7439-89-60.0198000.1500000.021601
ClipCopper alloyPhosphorus (P)7723-14-00.0066000.0500000.007201
Clip Total13.200000100.00000014.401047
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000038.543749
Lead FrameCopper alloyIron (Fe)7439-89-60.0531000.1500000.057932
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0177000.0500000.019310
Lead Frame Total35.400000100.00000038.620991
Mould CompoundFillerSilica fused60676-86-023.47200072.00000025.607681
Mould CompoundFillerSilica -amorphous-7631-86-92.0538006.3000002.240672
Mould CompoundPolymerEpoxy resin system1.9560006.0000002.133973
Mould CompoundAdditiveNon hazardous1.8908005.8000002.062841
Mould CompoundPolymerPhenol Formaldehyde resin (generic)9003-35-41.7604005.4000001.920576
Mould CompoundPolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.782457
Mould CompoundFlame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.711324
Mould CompoundPigmentCarbon black1333-86-40.0978000.3000000.106699
Mould Compound Total32.600000100.00000035.566223
Post-PlatingTin alloyTin (Sn)7440-31-51.92980799.9900002.105397
Post-PlatingImpurityNon hazardous0.0001930.0100000.000211
Post-Plating Total1.930000100.0000002.105608
Solder Paste 2Lead alloyLead (Pb)7439-92-13.57858992.4700003.904199
Solder Paste 2Lead alloyTin (Sn)7440-31-50.1935005.0000000.211106
Solder Paste 2Lead alloySilver (Ag)7440-22-40.0967502.5000000.105553
Solder Paste 2ImpurityAntimony (Sb)7440-36-00.0011610.0300000.001267
Solder Paste Total3.870000100.0000004.222125
Solder Paste 2 Total3.870000100.0000004.222125
Solder Paste 1Lead alloyLead (Pb)7439-92-11.72050092.5000001.877045
Solder Paste 1Lead alloyTin (Sn)7440-31-50.0930005.0000000.101462
Solder Paste 1Lead alloySilver (Ag)7440-22-40.0465002.5000000.050731
Solder Paste Total1.860000100.0000002.029238
Solder Paste 1 Total1.860000100.0000002.029238
PSMN8R0-40HL Total91.660000100.000000100.000000
Notes
Report created on 2024-11-20 08:40:02 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-11-20 08:40:02 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名稱
Material
有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
鉛 (Pb) 鎘 (Cd) 汞 (Hg) 六價(jià)鉻 (Cr6+) 多溴聯(lián)苯 (PBB) 多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)??????
夾子 (Clip)??????
引線框架 (Lead Frame)??????
模封料 (Mould Compound)??????
后鍍層 (Post-Plating)??????
錫膏2 (Solder Paste 2)??????
錫膏1 (Solder Paste 1)??????
? 表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
? 表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
? 該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-11-20 08:40:02 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
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