74ABT08
封裝
型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74ABT08D | 74ABT08D,118 (935207050118) |
Active | 74ABT08D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74ABT08PW | 74ABT08PW,118 (935207100118) |
Active | ABT08 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74ABT08DB | 74ABT08DB,112 (935207080112) |
Obsolete | ABT08 |
SSOP14 (SOT337-1) |
SOT337-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無(wú)信息 |
74ABT08DB,118 (935207080118) |
Obsolete | ABT08 | SOT337-1_118 | ||||
74ABT08PW | 74ABT08PW,112 (935207100112) |
Withdrawn / End-of-life | ABT08 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無(wú)信息 |
環(huán)境信息
型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74ABT08D | 74ABT08D,118 | 74ABT08D | ||
74ABT08PW | 74ABT08PW,118 | 74ABT08PW |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74ABT08DB | 74ABT08DB,112 | 74ABT08DB | ||
74ABT08DB | 74ABT08DB,118 | 74ABT08DB | ||
74ABT08PW | 74ABT08PW,112 | 74ABT08PW |
文檔 (19)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74ABT08 | Quad 2-input AND gate | Data sheet | 2024-01-18 |
sa00344 | Block diagram: 74ABT08D, 74ABT08DB, 74ABT08N, 74ABT08PW | Block diagram | 2009-11-04 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
abt08 | abt08 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
abt | abt Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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