74AUP3G0434
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AUP3G0434DC | 0.8?-?3.6 | CMOS | ± 1.9 | 4.0 | 70 | 3 | ultra low | -40~125 | VSSOP8 |
| 74AUP3G0434GN | 0.8?-?3.6 | CMOS | ± 1.9 | 4.0 | 70 | 3 | ultra low | -40~125 | XSON8 |
| 74AUP3G0434GS | 0.8?-?3.6 | CMOS | ± 1.9 | 4.0 | 70 | 3 | ultra low | -40~125 | XSON8 |
| 74AUP3G0434GT | 0.8?-?3.6 | CMOS | ± 1.9 | 4.0 | 70 | 3 | ultra low | -40~125 | XSON8 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP3G0434DC | 74AUP3G0434DCH (935299438125) |
Active | pZ |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74AUP3G0434GN | 74AUP3G0434GNX (935299443115) |
Active | pZ |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
| 74AUP3G0434GS | 74AUP3G0434GSX (935299444115) |
Active | pZ |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| 74AUP3G0434GT | 74AUP3G0434GTX (935299445115) |
Active | pZ |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP3G0434GD | 74AUP3G0434GDH (935299439125) |
Withdrawn / End-of-life | pZ |
XSON8 (SOT996-2) |
SOT996-2 | SOT996-2_125 | |
| 74AUP3G0434GF | 74AUP3G0434GFX (935299441115) |
Obsolete | no package information | ||||
| 74AUP3G0434GM | 74AUP3G0434GMH (935299442125) |
Obsolete | no package information | ||||
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP3G0434DC | 74AUP3G0434DCH | 74AUP3G0434DC |
|
|
| 74AUP3G0434GN | 74AUP3G0434GNX | 74AUP3G0434GN |
|
|
| 74AUP3G0434GS | 74AUP3G0434GSX | 74AUP3G0434GS |
|
|
| 74AUP3G0434GT | 74AUP3G0434GTX | 74AUP3G0434GT |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP3G0434GD | 74AUP3G0434GDH | 74AUP3G0434GD |
|
|
| 74AUP3G0434GF | 74AUP3G0434GFX | 74AUP3G0434GF |
|
|
| 74AUP3G0434GM | 74AUP3G0434GMH | 74AUP3G0434GM |
|
|
文檔 (23)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP3G0434 | Low-power dual inverter and single buffer | Data sheet | 2024-04-26 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| aup3g0434 | IBIS model | IBIS model | 2014-06-04 |
| Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| aup3g0434 | IBIS model | IBIS model | 2014-06-04 |
Ordering, pricing & availability
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