74AXP1G58
參數(shù)類型
| 型號 |
|---|
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP1G58GM | 74AXP1G58GMH (935301599125) |
Discontinued / End-of-life | RK |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AXP1G58GN | 74AXP1G58GNH (935301601125) |
Obsolete | no package information | ||||
| 74AXP1G58GS | 74AXP1G58GSH (935301602125) |
Obsolete | no package information | ||||
| 74AXP1G58GX | 74AXP1G58GXH (935307129125) |
Obsolete | RK |
X2SON6 (SOT1255-2) |
SOT1255-2 | 暫無信息 | |
| 74AXP1G58GXZ (935307129147) |
Withdrawn / End-of-life | RK | SOT1255-2_147 | ||||
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP1G58GM | 74AXP1G58GMH | 74AXP1G58GM |
|
|
| 74AXP1G58GN | 74AXP1G58GNH | 74AXP1G58GN |
|
|
| 74AXP1G58GS | 74AXP1G58GSH | 74AXP1G58GS |
|
|
| 74AXP1G58GX | 74AXP1G58GXH | 74AXP1G58GX |
|
|
| 74AXP1G58GX | 74AXP1G58GXZ | 74AXP1G58GX |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1G58 | Low-power configurable multiple function gate | Data sheet | 2021-10-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| axp1g58 | 74AXP1G58 IBIS model | IBIS model | 2015-09-08 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812 | Single configurable logic | Leaflet | 2019-01-04 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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