參數類型
型號 | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LV4052D | SP4T-Z | 1.0?-?6.0 | TTL | 125 | 15 | 180 | 0.4 | -60 | very low | -40~125 | SO16 |
74LV4052PW | SP4T-Z | 1.0?-?6.0 | TTL | 125 | 15 | 180 | 0.4 | -60 | very low | -40~125 | TSSOP16 |
封裝
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LV4052D | 74LV4052D,118 (935175840118) |
Active | 74LV4052D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74LV4052PW | 74LV4052PW,118 (935174950118) |
Active | LV4052 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LV4052DB | 74LV4052DB,112 (935174960112) |
Obsolete | LV4052 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
74LV4052DB,118 (935174960118) |
Withdrawn / End-of-life | LV4052 | 暫無信息 |
環(huán)境信息
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LV4052D | 74LV4052D,118 | 74LV4052D | ||
74LV4052PW | 74LV4052PW,118 | 74LV4052PW |
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LV4052DB | 74LV4052DB,112 | 74LV4052DB | ||
74LV4052DB | 74LV4052DB,118 | 74LV4052DB |
文檔 (18)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74LV4052 | Dual 4-channel analog multiplexer/demultiplexer | Data sheet | 2024-03-29 |
sv01700 | Block diagram: 74LV4052D, 74LV4052DB, 74LV4052N, 74LV4052PW | Block diagram | 2009-11-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lv | lv Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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