74LVC257A
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74LVC257ABQ | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 2.4 | low | -40~125 | DHVQFN16 |
| 74LVC257AD | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 2.4 | low | -40~125 | SO16 |
| 74LVC257APW | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 2.4 | low | -40~125 | TSSOP16 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC257ABQ | 74LVC257ABQ,115 (935275174115) |
Active | VC257A |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC257AD | 74LVC257AD,118 (935260678118) |
Active | 74LVC257AD |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC257APW | 74LVC257APW,118 (935260680118) |
Active | LVC257A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC257ADB | 74LVC257ADB,112 (935260679112) |
Obsolete | no package information | ||||
| 74LVC257ADB,118 (935260679118) |
Obsolete | ||||||
| 74LVC257APW | 74LVC257APW,112 (935260680112) |
Withdrawn / End-of-life | LVC257A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC257ABQ | 74LVC257ABQ,115 | 74LVC257ABQ |
|
|
| 74LVC257AD | 74LVC257AD,118 | 74LVC257AD |
|
|
| 74LVC257APW | 74LVC257APW,118 | 74LVC257APW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC257ADB | 74LVC257ADB,112 | 74LVC257ADB |
|
|
| 74LVC257ADB | 74LVC257ADB,118 | 74LVC257ADB |
|
|
| 74LVC257APW | 74LVC257APW,112 | 74LVC257APW |
|
|
文檔 (21)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC257A | Quad 2-input multiplexer with 5 V tolerant inputs/outputs; 3?-?state | Data sheet | 2024-01-24 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| mna868 | Block diagram: 74LVC257ABQ, 74LVC257AD, 74LVC257ADB, 74LVC257APW | Block diagram | 2009-11-04 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc257a | lvc257a IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc257a | lvc257a IBIS model | IBIS model | 2013-04-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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