74LVC573A
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74LVC573ABQ | 1.2?-?3.6 | TTL | ± 24 | 3.4 | low | -40~125 | DHVQFN20 |
| 74LVC573AD | 1.2?-?3.6 | TTL | ± 24 | 3.4 | low | -40~125 | SO20 |
| 74LVC573APW | 1.2?-?3.6 | TTL | ± 24 | 3.4 | low | -40~125 | TSSOP20 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC573ABQ | 74LVC573ABQ,115 (935273507115) |
Active | LVC573A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74LVC573AD | 74LVC573AD,118 (935219000118) |
Active | 74LVC573AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74LVC573APW | 74LVC573APW,118 (935219020118) |
Active | LVC573A LVC573A Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC573ABX | 74LVC573ABXX (935300601115) |
Obsolete | LVC573A Standard procedure Standard procedure | no package information | |||
| 74LVC573AD | 74LVC573AD,112 (935219000112) |
Withdrawn / End-of-life | 74LVC573AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74LVC573ADB | 74LVC573ADB,112 (935219010112) |
Obsolete | LVC573A LVC573A Standard Procedure Standard Procedure |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74LVC573ADB,118 (935219010118) |
Obsolete | LVC573A LVC573A Standard Procedure Standard Procedure | SOT339-1_118 | ||||
| 74LVC573APW | 74LVC573APW,112 (935219020112) |
Withdrawn / End-of-life | LVC573A LVC573A Standard Procedure Standard Procedure |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC573ABQ | 74LVC573ABQ,115 | 74LVC573ABQ |
|
|
| 74LVC573AD | 74LVC573AD,118 | 74LVC573AD |
|
|
| 74LVC573APW | 74LVC573APW,118 | 74LVC573APW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC573ABX | 74LVC573ABXX | 74LVC573ABX |
|
|
| 74LVC573AD | 74LVC573AD,112 | 74LVC573AD |
|
|
| 74LVC573ADB | 74LVC573ADB,112 | 74LVC573ADB |
|
|
| 74LVC573ADB | 74LVC573ADB,118 | 74LVC573ADB |
|
|
| 74LVC573APW | 74LVC573APW,112 | 74LVC573APW |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC573A | Octal D-type transparent latch with?5?V?tolerant?inputs?/?outputs; 3?-?state | Data sheet | 2023-09-07 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc573a | lvc573a IBIS model | IBIS model | 2013-04-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| lvc573a | lvc573a IBIS model | IBIS model | 2013-04-09 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機(jī)構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。