74LVT2245; 74LVTH2245
參數(shù)類(lèi)型
型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|---|
74LVT2245D | n.a. | n.a. | TTL | ± 12 | 3.2 | 8 | 150 | medium | -40~85 | SO20 |
74LVT2245PW | n.a. | n.a. | TTL | ± 12 | 3.2 | 8 | 150 | medium | -40~85 | TSSOP20 |
74LVTH2245D | n.a. | n.a. | TTL | ± 12 | 3.2 | 8 | 150 | medium | -40~85 | SO20 |
74LVTH2245PW | n.a. | n.a. | TTL | ± 12 | 3.2 | 8 | 150 | medium | -40~85 | TSSOP20 |
封裝
型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVT2245D | 74LVT2245D,118 (935211410118) |
Active | 74LVT2245 |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74LVT2245PW | 74LVT2245PW,118 (935211430118) |
Active | LVT2245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
74LVTH2245D | 74LVTH2245D,118 (935281746118) |
Active | 74LVTH2245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74LVTH2245PW | 74LVTH2245PW,118 (935281748118) |
Active | VTH2245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVT2245DB | 74LVT2245DB,112 (935211420112) |
Obsolete | no package information | ||||
74LVT2245DB,118 (935211420118) |
Obsolete | ||||||
74LVTH2245DB | 74LVTH2245DB,112 (935281747112) |
Obsolete | VTH2245 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無(wú)信息 |
74LVTH2245DB,118 (935281747118) |
Obsolete | VTH2245 | SOT339-1_118 |
環(huán)境信息
型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVT2245D | 74LVT2245D,118 | 74LVT2245D | ||
74LVT2245PW | 74LVT2245PW,118 | 74LVT2245PW | ||
74LVTH2245D | 74LVTH2245D,118 | 74LVTH2245D | ||
74LVTH2245PW | 74LVTH2245PW,118 | 74LVTH2245PW |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVT2245DB | 74LVT2245DB,112 | 74LVT2245DB | ||
74LVT2245DB | 74LVT2245DB,118 | 74LVT2245DB | ||
74LVTH2245DB | 74LVTH2245DB,112 | 74LVTH2245DB | ||
74LVTH2245DB | 74LVTH2245DB,118 | 74LVTH2245DB |
文檔 (15)
文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
---|---|---|---|
74LVT_LVTH2245 | 3.3 V octal transceiver with 30 ? termination resistors; 3?-?state | Data sheet | 2024-07-08 |
001aae465 | Block diagram: 74LVT2245D, 74LVT2245DB, 74LVT2245PW, 74LVTH2245D, 74LVTH2245DB, 74LVTH2245PW | Block diagram | 2009-11-04 |
mna817 | Block diagram: 74LVT2245D, 74LVT2245DB, 74LVT2245PW, 74LVTH2245D, 74LVTH2245DB, 74LVTH2245PW | Block diagram | 2009-11-03 |
mna818 | Block diagram: 74LVT2245D, 74LVT2245DB, 74LVT2245PW, 74LVTH2245D, 74LVTH2245DB, 74LVTH2245PW | Block diagram | 2009-11-04 |
mna819 | Block diagram: 74LVT2245D, 74LVT2245DB, 74LVT2245PW, 74LVTH2245D, 74LVTH2245DB, 74LVTH2245PW | Block diagram | 2009-11-04 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvt2245 | lvt2245 IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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