74VHC541; 74VHCT541
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74VHC541BQ | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | DHVQFN20 |
| 74VHC541D | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | SO20 |
| 74VHC541PW | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | TSSOP20 |
| 74VHCT541BQ | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | DHVQFN20 |
| 74VHCT541D | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | SO20 |
| 74VHCT541PW | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74VHC541BQ | 74VHC541BQ,115 (935289517115) |
Active | VHC541 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74VHC541D | 74VHC541D,118 (935289522118) |
Active | 74VHC541D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74VHC541PW | 74VHC541PW,118 (935289527118) |
Active | VHC541 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74VHCT541BQ | 74VHCT541BQ,115 (935289518115) |
Active | VHCT541 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74VHCT541D | 74VHCT541D,118 (935289523118) |
Active | 74VHCT541D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74VHCT541PW | 74VHCT541PW,118 (935289528118) |
Active | VHCT541 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74VHC541BQ | 74VHC541BQ,115 | 74VHC541BQ |
|
|
| 74VHC541D | 74VHC541D,118 | 74VHC541D |
|
|
| 74VHC541PW | 74VHC541PW,118 | 74VHC541PW |
|
|
| 74VHCT541BQ | 74VHCT541BQ,115 | 74VHCT541BQ |
|
|
| 74VHCT541D | 74VHCT541D,118 | 74VHCT541D |
|
|
| 74VHCT541PW | 74VHCT541PW,118 | 74VHCT541PW |
|
|
文檔 (14)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74VHC_VHCT541 | Octal buffer/line driver; 3-state | Data sheet | 2024-06-06 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| 74vhc541 | 74vhc541 IBIS model | IBIS model | 2013-04-08 |
| 74vhct541 | 74vhct541 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| 74vhc541 | 74vhc541 IBIS model | IBIS model | 2013-04-08 |
| 74vhct541 | 74vhct541 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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