BSP60; BSP61; BSP62
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | channel type (e) | Configuration | Ptot (mW) | IC [max] (mA) | hFE [min] | hFE [min] | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BSP60 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 2 | 1250.0 | -1000.0 | 2000.0 | 1000.0 | |||
| BSP61 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 2 | 1250.0 | -1000.0 | 2000.0 | 1000.0 | |||
| BSP62 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | 200 | PNP | 500 | 80 | 1250 | >2000 | N |
| BSP62-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | PNP | 500 | 1250 | 80 | 200 | 2000 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BSP60 | BSP60,115 (933986350115) |
Active | BSP60 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BSP61 | BSP61,115 (933986360115) |
Active | BSP61 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BSP62 | BSP62,115 (933969480115) |
Active | BSP62 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BSP62-Q | BSP62-QX (934664942115) |
Active | BSP62 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BSP60 | PNP Darlington transistor | Data sheet | 2018-05-02 |
| mgd624 | Block diagram: BSP60, BSP61, BSP62, PMST2907A | Block diagram | 2009-11-03 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| 75017516 | NXP secure microcontroller family SmartMX2 | Leaflet | 2014-03-23 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| DERATSMD | Power Derating Curves for SMDs; General | Other type | 1999-05-06 |
| LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
樣品
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