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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

參數(shù)類型

型號(hào) Package version Package name Size (mm) Configuration Nr of lines VRWM (V) (V) Cd [typ] (pF) IPPM [max] (A) VESD (kV) (kV)
PCMF1USB3B WLCSP5_2-1-2 WLCSP5 0.77 x 1.17 x 0.57 Bidirectional 2 4 0.3 9.5 20
PCMF2USB3B WLCSP10_4-2-4 WLCSP10 1.57 x 1.17 x 0.57 Bidirectional 4 4 0.3 9.5 20
PCMF3USB3B WLCSP15_6-3-6 WLCSP15 2.37 x 1.17 x 0.57 Bidirectional 6 4 0.3 9.5 20

封裝

型號(hào) 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
PCMF1USB3B PCMF1USB3B/CZ
(934660288087)
Active WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2 暫無(wú)信息
PCMF2USB3B PCMF2USB3B/CZ
(934660287087)
Active WLCSP10_4-2-4
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4 WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PCMF3USB3B PCMF3USB3B/CZ
(934660286087)
Active WLCSP15_6-3-6
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6 WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087

環(huán)境信息

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
PCMF1USB3B PCMF1USB3B/CZ PCMF1USB3B rohs rhf rhf
PCMF2USB3B PCMF2USB3B/CZ PCMF2USB3B rohs rhf rhf
PCMF3USB3B PCMF3USB3B/CZ PCMF3USB3B rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (10)

文件名稱 標(biāo)題 類型 日期
PCMFXUSB3B_C_SER Common-mode EMI filter for differential channels with integrated bidirectional ESD protection Data sheet 2019-01-29
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21

支持

如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱 標(biāo)題 類型 日期
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13

Ordering, pricing & availability

樣品

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