74LVC132A
參數(shù)類型
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LVC132ABQ | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | DHVQFN14 |
74LVC132AD | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | SO14 |
74LVC132APW | 1.2?-?3.6 | CMOS/LVTTL | ± 24 | 3.4 | 175 | 4 | low | -40~125 | TSSOP14 |
封裝
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC132ABQ | 74LVC132ABQ,115 (935282822115) |
Active | C132A |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74LVC132AD | 74LVC132AD,118 (935282821118) |
Active | 74LVC132AD |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LVC132APW | 74LVC132APW,118 (935282823118) |
Active | LVC132A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC132AD | 74LVC132AD,112 (935282821112) |
Withdrawn / End-of-life | 74LVC132AD |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
環(huán)境信息
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC132ABQ | 74LVC132ABQ,115 | 74LVC132ABQ | ||
74LVC132AD | 74LVC132AD,118 | 74LVC132AD | ||
74LVC132APW | 74LVC132APW,118 | 74LVC132APW |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC132AD | 74LVC132AD,112 | 74LVC132AD |
文檔 (17)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74LVC132A | Quad 2-input NAND Schmitt trigger | Data sheet | 2024-02-12 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lvc132a | lvc132a IBIS model | IBIS model | 2018-11-28 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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