74HC2G14; 74HCT2G14
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HC2G14GV | 2.0?-?6.0 | CMOS | ± 5.2 | 36 | 2 | low | -40~125 | TSOP6 |
| 74HC2G14GW | 2.0?-?6.0 | CMOS | ± 5.2 | 36 | 2 | low | -40~125 | TSSOP6 |
| 74HCT2G14GV | 4.5?-?5.5 | TTL | ± 4 | 36 | 2 | low | -40~125 | TSOP6 |
| 74HCT2G14GW | 4.5?-?5.5 | TTL | ± 4 | 36 | 2 | low | -40~125 | TSSOP6 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC2G14GV | 74HC2G14GV,125 (935281019125) |
Active | H14 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74HC2G14GW | 74HC2G14GW,125 (935281021125) |
Active | HK |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| 74HCT2G14GV | 74HCT2G14GV,125 (935281017125) |
Active | T14 |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74HCT2G14GW | 74HCT2G14GW,125 (935281018125) |
Active | TK |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC2G14GV | 74HC2G14GV,125 | 74HC2G14GV |
|
|
| 74HC2G14GW | 74HC2G14GW,125 | 74HC2G14GW |
|
|
| 74HCT2G14GV | 74HCT2G14GV,125 | 74HCT2G14GV |
|
|
| 74HCT2G14GW | 74HCT2G14GW,125 | 74HCT2G14GW |
|
|
文檔 (13)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT2G14 | Dual inverting Schmitt trigger | Data sheet | 2023-12-04 |
| mnb084 | Block diagram: 74HC2G14GV, 74HC2G14GW, 74HCT2G14GV, 74HCT2G14GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| hc2g14 | IBIS model 74HC2G14 | IBIS model | 2015-01-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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