74AUP1T00
參數(shù)類型
型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
---|---|---|---|---|---|---|---|---|---|---|
74AUP1T00GW | 2.3?-?3.6 | CMOS | ± 4 | 3.8 | 70 | 1 | ultra low | -40~125 | TSSOP5 | Uni-directional |
74AUP1T00GX | 2.3?-?3.6 | CMOS | ± 4 | 3.8 | 70 | 1 | ultra low | -40~125 | X2SON5 | Uni-directional |
封裝
型號(hào) | 可訂購的器件編號(hào),(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AUP1T00GW | 74AUP1T00GWH (935690039125) |
Active | 5a |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
74AUP1T00GX | 74AUP1T00GXH (935690041125) |
Active | 5a |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
環(huán)境信息
型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP1T00GW | 74AUP1T00GWH | 74AUP1T00GW | ||
74AUP1T00GX | 74AUP1T00GXH | 74AUP1T00GX |
文檔 (15)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74AUP1T00 | Low-power 2-input NAND gate with voltage-level translator | Data sheet | 2023-07-21 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
aup1t00 | IBIS model of 74AUP1T00 | IBIS model | 2017-12-14 |
Nexperia_74AUP1Txx_voltage_translators | Single supply logic gates with voltage translation | Leaflet | 2018-06-18 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶,您可以通過我們的銷售機(jī)構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶,我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。