參數類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| NCA9306DC | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.4 | 2 | low | -40~125 | VSSOP8 | Application specific |
| NCA9306DP | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.4 | 2 | low | -40~125 | TSSOP8 | Application specific |
| NCA9306GS | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.4 | 2 | low | -40~125 | XSON8 | Application specific |
| NCA9306GX | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.4 | 2 | low | -40~125 | X2SON8 | Application specific |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NCA9306DC | NCA9306DCH (935691026125) |
Active | h9 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| NCA9306DP | NCA9306DPH (935691027125) |
Active | h9 |
TSSOP8 (SOT505-2) |
SOT505-2 | SOT505-2_125 | |
| NCA9306GS | NCA9306GSX (935691932115) |
Active | h9 |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| NCA9306GX | NCA9306GXX (935691025115) |
Active | h9 |
X2SON8 (SOT1233-2) |
SOT1233-2 | SOT1233-2_115 |
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| NCA9306 | 2-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-08-05 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |