74LVC1T45-Q100; 74LVCH1T45-Q100
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1T45GM-Q100 | 1.2?-?5.5 | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 2.5 | 1 | low | -40~125 | 294 | 6.8 | 147 | XSON6 |
| 74LVC1T45GW-Q100 | 1.2?-?5.5 | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 2.5 | 1 | low | -40~125 | 268 | 41.4 | 156 | TSSOP6 |
| 74LVCH1T45GW-Q100 | 1.2?-?5.5 | 1.2?-?5.5 | CMOS/LVTTL | ± 24 | 2.5 | 1 | low | -40~125 | 268 | 41.4 | 156 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1T45GM-Q100 | 74LVC1T45GM-Q100X (935690846115) |
Active | V5 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1T45GW-Q100 | 74LVC1T45GW-Q100H (935300935125) |
Active | V5 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| 74LVCH1T45GW-Q100 | 74LVCH1T45GW-Q100H (935300936125) |
Active | X5 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1T45GM-Q100 | 74LVC1T45GM-Q100X | 74LVC1T45GM-Q100 |
|
|
| 74LVC1T45GW-Q100 | 74LVC1T45GW-Q100H | 74LVC1T45GW-Q100 |
|
|
| 74LVCH1T45GW-Q100 | 74LVCH1T45GW-Q100H | 74LVCH1T45GW-Q100 |
|
|
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC_LVCH1T45_Q100 | Dual supply translating transceiver; 3-state | Data sheet | 2023-08-04 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1t45 | lvc1t45 IBIS model | IBIS model | 2013-04-08 |
| lvch1t45 | lvch1t45 IBIS model | IBIS model | 2013-04-09 |
| Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 | Automotive logic in MicroPak leadless packages | Leaflet | 2019-04-18 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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