外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| OL-PCMF2HDMI2BA-C | WLCSP10 | wafer level chip-size package; 10 bumps (4-2-4) | 2020-05-06 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| OL-PCMF2HDMI2BA-C | 3D model for products with OL-PCMF2HDMI2BA-C package | Design support | 2023-03-13 |
| OL-PCMF2HDMI2BA-C | wafer level chip-size package; 10 bumps (4-2-4) | Package information | 2022-01-04 |
采用此封裝的產(chǎn)品
ESD protection, TVS, filtering and signal conditioning
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PCMF2HDMI2BA-C | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |