外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOD323 | SOD323 | plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body | SC-76 (EIAJ) | 2006-03-16 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_brochure_ESD-Protection-Applications_022017 | ESD Protection Application guide | Brochure | 2018-12-21 |
| SOD323 | 3D model for products with SOD323 package | Design support | 2022-11-04 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOD323_mk | plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| SOD323 | plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body | Package information | 2022-05-27 |
| SOD323_115 | Reel pack for SMD, 7"; Q1/T1-Q2/T3 product orientation | Packing information | 2025-01-20 |
| SOD323_135 | Reel pack for SMD, 11"; Q1/T1-Q2/T3 product orientation | Packing information | 2025-01-20 |
| SOD323_145 | Reel pack for SMD, 7"; Q1/T1-Q2/T3 product orientation | Packing information | 2025-01-20 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PESD1IVN27-A | ESD protection for In-vehicle networks |
|