可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
---|---|---|---|---|
74AUP1G373GW | 74AUP1G373GW,125 | 935280621125 | SOT363-2 | 訂單產品 |
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Click here for more informationLow-power D-type transparent latch; 3-state
The 74AUP1G373 is a single D-type transparent latch; 3-state. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Low static power consumption; ICC = 0.9 μA (maximum)
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|
74AUP1G373GW | 0.8?-?3.6 | CMOS | 1.9/-1.9 | 8.5 | ultra low | -40~125 | TSSOP6 |
Model Name | 描述 |
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型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AUP1G373GW | 74AUP1G373GW,125 (935280621125) |
Active | aW |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74AUP1G373 | Low-power D-type transparent latch; 3-state | Data sheet | 2023-07-13 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
aup1g373 | aup1g373 IBIS model | IBIS model | 2014-12-21 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT363-2_125 | TSSOP6 ; Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2022-11-04 |
74AUP1G373GW_Nexperia_Product_Reliability | 74AUP1G373GW Nexperia Product Reliability | Quality document | 2024-06-16 |
型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
---|---|---|---|---|---|---|
74AUP1G373GW | 74AUP1G373GW,125 | 935280621125 | Active | SOT363-2_125 | 3,000 | 訂單產品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.