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Click here for more information參數(shù)類型
型號 | Package name |
---|---|
74LVC1G123GF | XSON8 |
PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC1G123GF | 74LVC1G123GF,115 (935295671115) |
Obsolete | Y3 |
XSON8 (SOT1089) |
SOT1089 |
REFLOW_BG-BD-1
|
SOT1089_115 |
Series
文檔 (9)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74LVC1G123 | Single retriggerable monostable multivibrator; Schmitt?trigger inputs | Data sheet | 2023-08-14 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 |
lvc1g123 | 74LVC1G123 IBIS model | IBIS model | 2015-04-03 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
XSON8_SOT1089_mk | plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT1089 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1089 | MAR_SOT1089 Topmark | Top marking | 2013-06-03 |
支持
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PCB Symbol, Footprint and 3D Model
Model Name | 描述 |
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.