可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| PESD1USB30 | PESD1USB30Z | 934069595087 | WLCSP5_2-1-2 | 訂單產(chǎn)品 |
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Click here for more informationPESD1USB30
ESD protection for differential data lines
PESD1USB30 is an ElectroStatic Discharge (ESD) protection device for one differential channel.
It is footprint compatible to PCMF1USB30 common mode filters with ESD protection.
Features and benefits
Allows switching between PCMF1USB30 common mode filters with ESD protection and PESD1USB30 ESD protection in the same footprint.
The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
TrEOS process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs).
Industry-standard Wafer-Level Chip Scale package (WLCSP5).
Applications
Smartphone, cellular and cordless phone
Tablet PC and Mobile Internet Device (MID)
USB3.1, USB2.0, HDMI2.0, HDMI1.4
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
General-purpose downstream ESD protection for differential data lines
參數(shù)類型
| 型號 | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD1USB30 | WLCSP5 | 1 | Unidirectional | 5 | 0.45 | 15 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD1USB30 | PESD1USB30Z (934069595087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暫無信息 |
文檔 (7)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESDXUSB30_SER | ESD protection for differential data lines | Data sheet | 2018-04-17 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| PESD1USB30_Nexperia_Product_Reliability | PESD1USB30 Nexperia Product Reliability | Quality document | 2024-06-14 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PESD1USB30 | PESD1USB30Z | 934069595087 | Active | 暫無信息 | 4,500 |
|
樣品
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.