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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

PESD3V3V4UF

Very low capacitance unidirectional quadruple ESD protection diode arrays

Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.

此產(chǎn)品已停產(chǎn)

Features and benefits

  • ESD protection of up to four lines
  • Ultra low leakage current: IRM = 25 nA
  • Very low diode capacitance
  • ESD protection up to 12 kV
  • Max. peak pulse power: PPP = 16 W
  • IEC 61000-4-2; level 4 (ESD)
  • Low clamping voltage: VCL = 11 V
  • IEC 61000-4-5 (surge); IPP = 1.5 A

Applications

  • Computers and peripherals
  • Communication systems
  • Audio and video equipment
  • Portable electronics
  • Cellular handsets and accessories
  • Subscriber Identity Module (SIM) card protection

參數(shù)類型

型號(hào) Package name
PESD3V3V4UF XSON6

封裝

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
PESD3V3V4UF PESD3V3V4UF,115
(934061197115)		 Obsolete SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115

環(huán)境信息

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
PESD3V3V4UF PESD3V3V4UF,115 PESD3V3V4UF rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (11)

文件名稱 標(biāo)題 類型 日期
PESDXV4UF_G_W Very low capacitance unidirectional quadruple ESD protection diode arrays Data sheet 2022-05-03
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2012-07-22
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2024-10-14
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱 標(biāo)題 類型 日期
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2012-07-22
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2024-10-14
SOT886 3D model for products with SOT886 package Design support 2019-10-03

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.