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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

PSMN5R3-25MLD

N-channel 25 V, 5.3 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK33 package. NextPowerS3 portfolio utilising Nexperia’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETS with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

Features and benefits

  • Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies

  • Superfast switching with soft-recovery; s-factor > 1

  • Low spiking and ringing for low EMI designs

  • Unique “SchottkyPlus” technology; Schottky-like performance with < 1 μA leakage at 25 °C

  • Optimised for 4.5 V gate drive

  • Low parasitic inductance and resistance

  • High reliability clip bonded and solder die attach Mini Power SO8 package; no glue, no wire bonds, qualified to 175 °C

  • Exposed leads for optimal visual solder inspection

Applications

  • On-board DC:DC solutions for server and telecommunications

  • Secondary-side synchronous rectification in telecommunication applications

  • Voltage regulator modules (VRM)

  • Point-of-Load (POL) modules

  • Power delivery for V-core, ASIC, DDR, GPU, VGA and system components

  • Brushed and brushless motor control

參數(shù)類(lèi)型

型號(hào) Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PSMN5R3-25MLD SOT1210 LFPAK33 Production N 1 25 5.9 8.49 175 70 1.3 5.9 12.7 51 10.8 1.8 N 858 628 2016-03-22

封裝

型號(hào) 可訂購(gòu)的器件編號(hào),(訂購(gòu)碼(12NC)) 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
PSMN5R3-25MLD PSMN5R3-25MLDX
(934069917115)
Active 5D325L SOT1210
LFPAK33
(SOT1210)
SOT1210 REFLOW_BG-BD-1
SOT1210_115

環(huán)境信息

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
PSMN5R3-25MLD PSMN5R3-25MLDX PSMN5R3-25MLD rohs rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (20)

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PSMN5R3-25MLD N-channel 25 V, 5.3 mΩ logic level MOSFET in LFPAK33 using NextPowerS3 Technology Data sheet 2018-04-02
AN10273 Power MOSFET single-shot and repetitive avalanche ruggedness rating Application note 2022-06-20
AN11156 Using Power MOSFET Zth Curves Application note 2021-01-04
AN11158 Understanding power MOSFET data sheet parameters Application note 2020-07-06
AN11160 Designing RC Snubbers Application note 2024-10-21
AN11243 Failure signature of Electrical Overstress on Power MOSFETs Application note 2017-12-21
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90003 LFPAK MOSFET thermal design guide Application note 2023-08-22
SOT1210 3D model for products with SOT1210 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK33_SOT1210_mk Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body Marcom graphics 2017-01-28
SOT1210 Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch Package information 2024-07-24
SOT1210_115 LFPAK33; Reel pack for SMD, 7"; Q1/T1 product orientation Packing information 2022-06-07
T9_SOT1210_PSMN5R3-25MLD_Nexperia_Quality_document PSMN5R3-25MLD Quality document Quality document 2024-07-29
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PSMN5R3-25MLD PSMN5R3-25MLD SPICE model SPICE model 2016-04-13
TN00008 Power MOSFET frequently asked questions and answers Technical note 2024-08-09
PSMN5R3-25MLD_RC_Thermal_Model PSMN5R3-25MLD Thermal design model Thermal design 2021-01-18
PSMN5R3-25MLD PSMN5R3-25MLD Thermal model Thermal model 2016-04-13

支持

如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
PSMN5R3-25MLD PSMN5R3-25MLD SPICE model SPICE model 2016-04-13
PSMN5R3-25MLD_RC_Thermal_Model PSMN5R3-25MLD Thermal design model Thermal design 2021-01-18
PSMN5R3-25MLD PSMN5R3-25MLD Thermal model Thermal model 2016-04-13
SOT1210 3D model for products with SOT1210 package Design support 2017-06-30

訂購(gòu)、定價(jià)與供貨

型號(hào) Orderable part number Ordering code (12NC) 狀態(tài) 包裝 Packing Quantity 在線購(gòu)買(mǎi)
PSMN5R3-25MLD PSMN5R3-25MLDX 934069917115 Active SOT1210_115 1,500 訂單產(chǎn)品

樣品

作為 Nexperia 的客戶(hù),您可以通過(guò)我們的銷(xiāo)售機(jī)構(gòu)訂購(gòu)樣品。

如果您沒(méi)有 Nexperia 的直接賬戶(hù),我們的全球和地區(qū)分銷(xiāo)商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷(xiāo)商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可訂購(gòu)部件

型號(hào) 可訂購(gòu)的器件編號(hào) 訂購(gòu)代碼(12NC) 封裝 從經(jīng)銷(xiāo)商處購(gòu)買(mǎi)
PSMN5R3-25MLD PSMN5R3-25MLDX 934069917115 SOT1210 訂單產(chǎn)品