74LVC1G53
參數(shù)類(lèi)型
| 型號(hào) | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G53DC | SPDT-Z | 1.65?-?5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | VSSOP8 |
| 74LVC1G53DP | SPDT-Z | 1.65?-?5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | TSSOP8 |
| 74LVC1G53GN | SPDT-Z | 1.65?-?5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | XSON8 |
| 74LVC1G53GS | SPDT-Z | 1.65?-?5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | XSON8 |
| 74LVC1G53GT | SPDT-Z | 1.65?-?5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | XSON8 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G53DC | 74LVC1G53DC,125 (935279945125) |
Active | V53 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74LVC1G53DP | 74LVC1G53DP,125 (935279944125) |
Active | V53 |
TSSOP8 (SOT505-2) |
SOT505-2 | SOT505-2_125 | |
| 74LVC1G53GN | 74LVC1G53GN,115 (935292234115) |
Active | V3 |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
| 74LVC1G53GS | 74LVC1G53GS,115 (935292378115) |
Active | V3 |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| 74LVC1G53GT | 74LVC1G53GT,115 (935280312115) |
Active | V53 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G53GF | 74LVC1G53GF,115 (935291499115) |
Obsolete | no package information | ||||
| 74LVC1G53GM | 74LVC1G53GM,125 (935284479125) |
Withdrawn / End-of-life | V53 |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 | |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G53DC | 74LVC1G53DC,125 | 74LVC1G53DC |
|
|
| 74LVC1G53DP | 74LVC1G53DP,125 | 74LVC1G53DP |
|
|
| 74LVC1G53GN | 74LVC1G53GN,115 | 74LVC1G53GN |
|
|
| 74LVC1G53GS | 74LVC1G53GS,115 | 74LVC1G53GS |
|
|
| 74LVC1G53GT | 74LVC1G53GT,115 | 74LVC1G53GT |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G53GF | 74LVC1G53GF,115 | 74LVC1G53GF |
|
|
| 74LVC1G53GM | 74LVC1G53GM,125 | 74LVC1G53GM |
|
|
文檔 (27)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74LVC1G53 | 2-channel analog multiplexer/demultiplexer | Data sheet | 2024-04-30 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| 001aah795 | Block diagram: 74LVC1G53DC, 74LVC1G53DP, 74LVC1G53GD, 74LVC1G53GT | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| lvc1g53 | 74LVC1G53 IBIS model | IBIS model | 2015-02-19 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| lvc1g53 | 74LVC1G53 IBIS model | IBIS model | 2015-02-19 |
Ordering, pricing & availability
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