NMUX1309
參數(shù)類型
| 型號 | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| NMUX1309BQ | SP4T-Z | 1.5?-?5.5 | CMOS | 60 | - | 380 | - | -105 | very low | -40~125 | DHVQFN16 |
| NMUX1309PW | SP4T-Z | 1.5?-?5.5 | CMOS | 60 | - | 380 | - | -105 | very low | -40~125 | TSSOP16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| NMUX1309BQ | NMUX1309BQX (935691415115) |
Active | NM1309 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| NMUX1309PW | NMUX1309PWJ (935691417118) |
Active | NMU1309 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| NMUX1309BQ | NMUX1309BQX | NMUX1309BQ |
|
|
| NMUX1309PW | NMUX1309PWJ | NMUX1309PW |
|
|
文檔 (13)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| NMUX1309 | 1.5 V to 5.5 V, dual 4-channel switch analog multiplexer and demultiplexer with injection-current control | Data sheet | 2024-08-23 |
| AN90051 | Pin FMEA for NMUX130x family | Application note | 2024-02-13 |
| Footprint_MUX1308 | Altium footprint and schematic symbol for the MUX13 | Design support | 2024-07-31 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| 1_8V_General_purpose_injection_control_analog_switch_leaflet | 1.8 V General purpose SP8T-Z and 2x SP4T-Z analog switches with injection current control | Leaflet | 2024-03-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| UM90026 | NMUX1308; NMUX1309 evaluation board | User manual | 2024-04-30 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| Footprint_MUX1308 | Altium footprint and schematic symbol for the MUX13 | Design support | 2024-07-31 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
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