74AUP1G3208
參數(shù)類型
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AUP1G3208GM | 0.8?-?3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G3208GN | 0.8?-?3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G3208GS | 0.8?-?3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G3208GW | 0.8?-?3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | TSSOP6 |
74AUP1G3208GX | 0.8?-?3.6 | CMOS | ± 1.9 | 7.4 | 70 | 1 | ultra low | -40~125 | X2SON6 |
封裝
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AUP1G3208GM | 74AUP1G3208GM,115 (935280617115) |
Active | a2 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74AUP1G3208GM,132 (935280617132) |
Active | a2 | SOT886_132 | ||||
74AUP1G3208GN | 74AUP1G3208GN,132 (935291734132) |
Active | a2 |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74AUP1G3208GS | 74AUP1G3208GS,132 (935292858132) |
Active | a2 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74AUP1G3208GW | 74AUP1G3208GW,125 (935280616125) |
Active | a2 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74AUP1G3208GX | 74AUP1G3208GXZ (935308466147) |
Active | a2 |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
環(huán)境信息
型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP1G3208GM | 74AUP1G3208GM,115 | 74AUP1G3208GM | ||
74AUP1G3208GM | 74AUP1G3208GM,132 | 74AUP1G3208GM | ||
74AUP1G3208GN | 74AUP1G3208GN,132 | 74AUP1G3208GN | ||
74AUP1G3208GS | 74AUP1G3208GS,132 | 74AUP1G3208GS | ||
74AUP1G3208GW | 74AUP1G3208GW,125 | 74AUP1G3208GW | ||
74AUP1G3208GX | 74AUP1G3208GXZ | 74AUP1G3208GX |
文檔 (32)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74AUP1G3208 | Low-power 3-input OR-AND gate | Data sheet | 2023-07-18 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
001aad505 | Block diagram: 74AUP1G3208GF, 74AUP1G3208GM, 74AUP1G3208GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
aup1g3208 | 74AUP1G3208 IBIS model | IBIS model | 2016-02-24 |
Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持,請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
aup1g3208 | 74AUP1G3208 IBIS model | IBIS model | 2016-02-24 |
Ordering, pricing & availability
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