BCP54-Q Series
參數(shù)類型
| 型號(hào) | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP54-10-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650 | 45 | 1000 | 63 | 160 | 150 | 100 | Y |
| BCP54-16-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 45.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BCP54-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 45.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BCP54-10-Q | BCP54-10-QF (934665109135) |
Active | BCP54 /10 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_135 |
| BCP54-16-Q | BCP54-16-QF (934664781135) |
Active | BCP54 /16 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_135 |
| BCP54-16-QX (934664781115) |
Active | BCP54 /16 | SOT223_115 | ||||
| BCP54-Q | BCP54-QX (934664783115) |
Active | BCP54 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP54-QF (934664783135) |
Active | BCP54 | SOT223_135 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BCP54-10-Q | BCP54-10-QF | BCP54-10-Q |
|
|
| BCP54-16-Q | BCP54-16-QF | BCP54-16-Q |
|
|
| BCP54-16-Q | BCP54-16-QX | BCP54-16-Q |
|
|
| BCP54-Q | BCP54-QX | BCP54-Q |
|
|
| BCP54-Q | BCP54-QF | BCP54-Q |
|
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文檔 (7)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| BCP54-Q_SER | 45 V, 1 A NPN medium power transistors | Data sheet | 2023-01-06 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Ordering, pricing & availability
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