74LVC373A-Q100
參數(shù)類型
型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC373ABQ-Q100 | 1.2?-?3.6 | TTL | ± 24 | 3 | 8 | low | -40~125 | DHVQFN20 |
74LVC373AD-Q100 | 1.2?-?3.6 | TTL | ± 24 | 3 | 8 | low | -40~125 | SO20 |
74LVC373APW-Q100 | 1.2?-?3.6 | TTL | ± 24 | 3 | 8 | low | -40~125 | TSSOP20 |
封裝
型號(hào) | 可訂購的器件編號(hào),(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC373ABQ-Q100 | 74LVC373ABQ-Q100X (935301363115) |
Active | LVC373A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74LVC373AD-Q100 | 74LVC373AD-Q100J (935301365118) |
Active | 74LVC373AD |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74LVC373APW-Q100 | 74LVC373APW-Q100J (935301185118) |
Active | LVC373A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購的器件編號(hào),(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC373ADB-Q100 | 74LVC373ADB-Q100J (935301364118) |
Obsolete | LVC373A |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT339-1_118 |
環(huán)境信息
型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC373ABQ-Q100 | 74LVC373ABQ-Q100X | 74LVC373ABQ-Q100 | ||
74LVC373AD-Q100 | 74LVC373AD-Q100J | 74LVC373AD-Q100 | ||
74LVC373APW-Q100 | 74LVC373APW-Q100J | 74LVC373APW-Q100 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC373ADB-Q100 | 74LVC373ADB-Q100J | 74LVC373ADB-Q100 |
文檔 (17)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74LVC373A_Q100 | Octal D-type transparent latch with 5 V tolerant inputs?/?outputs; 3-state | Data sheet | 2023-08-28 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvc373a | lvc373a IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持,請告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
lvc373a | lvc373a IBIS model | IBIS model | 2013-04-09 |
Ordering, pricing & availability
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