74LVC1G08
參數(shù)類型
型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LVC1G08GM | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
74LVC1G08GN | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
74LVC1G08GS | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | XSON6 |
74LVC1G08GV | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | TSOP5 |
74LVC1G08GW | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | TSSOP5 |
74LVC1G08GX | 1.65?-?5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | X2SON5 |
74LVC1G08GZ | XSON5 |
封裝
型號(hào) | 可訂購的器件編號(hào),(訂購碼(12NC)) | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74LVC1G08GM | 74LVC1G08GM,115 (935277188115) |
Active | VE |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74LVC1G08GM,132 (935277188132) |
Active | VE | SOT886_132 | ||||
74LVC1G08GN | 74LVC1G08GN,132 (935291774132) |
Active | VE |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74LVC1G08GS | 74LVC1G08GS,132 (935292897132) |
Active | VE |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74LVC1G08GV | 74LVC1G08GV,125 (935272011125) |
Active | V08 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
74LVC1G08GW | 74LVC1G08GW,125 (935268380125) |
Active | VE |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
74LVC1G08GX | 74LVC1G08GX,125 (935298378125) |
Active | VE |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | |
74LVC1G08GZ | 74LVC1G08GZYL (935691521315) |
Active | VE |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
環(huán)境信息
型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC1G08GM | 74LVC1G08GM,115 | 74LVC1G08GM | ||
74LVC1G08GM | 74LVC1G08GM,132 | 74LVC1G08GM | ||
74LVC1G08GN | 74LVC1G08GN,132 | 74LVC1G08GN | ||
74LVC1G08GS | 74LVC1G08GS,132 | 74LVC1G08GS | ||
74LVC1G08GV | 74LVC1G08GV,125 | 74LVC1G08GV | ||
74LVC1G08GW | 74LVC1G08GW,125 | 74LVC1G08GW | ||
74LVC1G08GX | 74LVC1G08GX,125 | 74LVC1G08GX | ||
74LVC1G08GZ | 74LVC1G08GZYL | 74LVC1G08GZ |
文檔 (39)
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
74LVC1G08 | Single 2-input AND gate | Data sheet | 2024-09-03 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
mna113 | Block diagram: 74AHC1G08GV, 74AHC1G08GW, 74AHCT1G08GV, 74AHCT1G08GW, 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW, 74LVC1G08GF, 74LVC1G08GM, 74LVC1G08GV, 74LVC1G08GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持,請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
文件名稱 | 標(biāo)題 | 類型 | 日期 |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶,您可以通過我們的銷售機(jī)構(gòu)訂購樣品。
如果您沒有 Nexperia 的直接賬戶,我們的全球和地區(qū)分銷商網(wǎng)絡(luò)可為您提供 Nexperia 樣品支持。查看官方經(jīng)銷商列表。