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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

參數(shù)類型

型號(hào) VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP1G332GM 0.8?-?3.6 CMOS ± 1.9 6.8 70 1 ultra low -40~125 XSON6
74AUP1G332GN 0.8?-?3.6 CMOS ± 1.9 6.8 70 1 ultra low -40~125 XSON6
74AUP1G332GS 0.8?-?3.6 CMOS ± 1.9 6.8 70 1 ultra low -40~125 XSON6
74AUP1G332GW 0.8?-?3.6 CMOS ± 1.9 6.8 70 1 ultra low -40~125 TSSOP6

封裝

型號(hào) 可訂購的器件編號(hào)，（訂購碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
74AUP1G332GM 74AUP1G332GM,115
(935280752115)		 Active aG SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74AUP1G332GM,132
(935280752132)		 Active aG SOT886_132
74AUP1G332GN 74AUP1G332GN,132
(935291736132)		 Active aG SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74AUP1G332GS 74AUP1G332GS,132
(935292861132)		 Active aG SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74AUP1G332GW 74AUP1G332GW,125
(935280751125)		 Active aG SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購的器件編號(hào)，（訂購碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
74AUP1G332GF 74AUP1G332GF,132
(935281327132)		 Obsolete aG SOT891
XSON6
(SOT891) 		SOT891 REFLOW_BG-BD-1
SOT891_132

環(huán)境信息

型號(hào) 可訂購的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
74AUP1G332GM 74AUP1G332GM,115 74AUP1G332GM rohs rhf rhf
74AUP1G332GM 74AUP1G332GM,132 74AUP1G332GM rohs rhf rhf
74AUP1G332GN 74AUP1G332GN,132 74AUP1G332GN rohs rhf rhf
74AUP1G332GS 74AUP1G332GS,132 74AUP1G332GS rohs rhf rhf
74AUP1G332GW 74AUP1G332GW,125 74AUP1G332GW rohs rhf rhf

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
74AUP1G332GF 74AUP1G332GF,132 74AUP1G332GF rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (28)

文件名稱 標(biāo)題 類型 日期
74AUP1G332 Low-power 3-input OR-gate Data sheet 2023-07-18
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
001aad933 Block diagram: 74AUP1G332GF, 74AUP1G332GM, 74AUP1G332GW, 74LVC1G332GF, 74LVC1G332GM, 74LVC1G332GV, 74LVC1G332GW Block diagram 2009-11-03
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g332 aup1g332 IBIS model IBIS model 2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1010-6_SOT891_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
SOT891 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body Package information 2020-04-21
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT891 MAR_SOT891 Topmark Top marking 2013-06-03
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

支持

如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱 標(biāo)題 類型 日期
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g332 aup1g332 IBIS model IBIS model 2014-12-21

樣品

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