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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車(chē)應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

參數(shù)類(lèi)型

型號(hào) VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1G32GM 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 XSON6
74LVC1G32GN 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 XSON6
74LVC1G32GS 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 XSON6
74LVC1G32GV 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 TSOP5
74LVC1G32GW 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 TSSOP5
74LVC1G32GX 1.65?-?5.5 CMOS/LVTTL ± 32 2.1 150 1 low -40~125 X2SON5
74LVC1G32GZ XSON5

封裝

型號(hào) 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
74LVC1G32GM 74LVC1G32GM,115
(935277189115)		 Active VG SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1G32GM,132
(935277189132)		 Active VG SOT886_132
74LVC1G32GN 74LVC1G32GN,132
(935288985132)		 Active VG SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74LVC1G32GS 74LVC1G32GS,132
(935292909132)		 Active VG SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74LVC1G32GV 74LVC1G32GV,125
(935272013125)		 Active V32 SOT753
TSOP5
(SOT753) 		SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74LVC1G32GW 74LVC1G32GW,125
(935268381125)		 Active VG SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125
74LVC1G32GX 74LVC1G32GX,125
(935298226125)		 Active VG SOT1226-3
X2SON5
(SOT1226-3) 		SOT1226-3 SOT1226-3_125
74LVC1G32GZ 74LVC1G32GZYL
(935691638315)		 Active VG SOT8065-1
XSON5
(SOT8065-1) 		SOT8065-1 SOT8065-1_315

環(huán)境信息

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
74LVC1G32GM 74LVC1G32GM,115 74LVC1G32GM rohs rhf rhf
74LVC1G32GM 74LVC1G32GM,132 74LVC1G32GM rohs rhf rhf
74LVC1G32GN 74LVC1G32GN,132 74LVC1G32GN rohs rhf rhf
74LVC1G32GS 74LVC1G32GS,132 74LVC1G32GS rohs rhf rhf
74LVC1G32GV 74LVC1G32GV,125 74LVC1G32GV rohs rhf rhf
74LVC1G32GW 74LVC1G32GW,125 74LVC1G32GW rohs rhf rhf
74LVC1G32GX 74LVC1G32GX,125 74LVC1G32GX rohs rhf rhf
74LVC1G32GZ 74LVC1G32GZYL 74LVC1G32GZ rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (39)

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
74LVC1G32 Single 2-input OR gate Data sheet 2024-09-03
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
mna164 Block diagram: 74LVC1G32GF, 74LVC1G32GM, 74LVC1G32GV, 74LVC1G32GW Block diagram 2009-11-04
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g32 74LVC1G32 IBIS model IBIS model 2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
Leaflet_SOT8065_Minilogic Leaflet_SOT8065 Minilogic Leaflet 2024-11-15
DFN1010-6_SOT891_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT891 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body Package information 2020-04-21
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
SOT1226-3 plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm Package information 2020-08-27
SOT8065-1 Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm Package information 2024-08-28
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT891 MAR_SOT891 Topmark Top marking 2013-06-03
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫(xiě) 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱(chēng) 標(biāo)題 類(lèi)型 日期
SOT891 3D model for products with SOT891 package Design support 2019-10-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
SOT1226-3 3D model for products with SOT1226-3 package Design support 2021-01-28
SOT8065-1 3D model for products with SOT8065-1 package Design support 2024-11-05
lvc1g32 74LVC1G32 IBIS model IBIS model 2014-10-20

樣品

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