Automotive DFN packages range - high component density

Table 1.

Package	DFN1006BD-2 (SOD882BD-2)	DFN1110D-3 (SOT8015)	DFN1412D-3 (SOT8009)	DFN1608D-2 (SOD1608)	DFN2020D-3 (SOT1061D)	DFN2020D-6 (SOT1118D)	DFN2020MD-6 (SOT1220)
Package area mm2	0.6	1.1	1.68	1.28	4	4	4
Body size (l x w x h) (mm)	1.0 x 0.6 x 0.5	1.1 x 1.0 x 0.5	1.4 x 1.2 x 0.5	1.6 x 0.8 x 0.37	2.0 x 2.0 x 0.6	2.0 x 2.0 x 0.6	2.0 x 2.0 x 0.6
Rth(j-sp) (K/W)	46	60	53	20	16	25	5

Space efficient designs

DFN offers an equal electrical performance on a smaller footprint compared to standard SMD packages.

• Ultra-compact footprint

• Very low height

• AEC-Q101 qualified alternatives exist for all leaded SMD packages

High thermal performance

• High power dissipation (P_tot)

• Low operating temperature extending the total system lifetime

• T_j = 175 °C capability

AOI capable and reliable

• Side-wettable flanks for easy automated optical inspection (AOI)

• Robust solder joints, high reliability