外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOD323HP | CFP2-HP | SOD323HP: plastic surface-mounted package with solderable lead ends; 2.2 mm x 1.3 mm x 0.68 mm body | DO-219AD (JEDEC) | 2021-04-07 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOD323HP | 3D model for products with SOD323HP package | Design support | 2022-02-14 |
| SOD323HP | SOD323HP: plastic surface-mounted package with solderable lead ends; 2.2 mm x 1.3 mm x 0.68 mm body | Package information | 2023-08-02 |
| SOD323HP_115 | Reel pack for SMD, 7"; Q1/T1-Q2/T3 product orientation | Packing information | 2021-09-07 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪問 |
|---|---|---|
| PMEG60T10ELXD-Q | 60 V, 1 A Trench Schottky barrier rectifier |
|