外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT223 | SC-73 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | SC-73 (EIAJ) | 2006-03-16 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| SOT223_115 | SC-73; Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2024-02-15 |
| SOT223_135 | SC-73; Reel pack for SMD, 13"; Q3/T4 product orientation | Packing information | 2024-02-15 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| NEX90015ADG-Q100 | 150 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator |
|