外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8076-1 | HWQFN16 | plastic thermal enhanced very very thin Quad Flat packages; no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | MO-220 (WEED-4) (JEDEC) | 2023-03-20 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8076-1 | plastic thermal enhanced very very thin Quad Flat packages;no leads; 16 terminals; 0.5 mm pitch; 3.0 × 3.0 × 0.75 mm body | Package information | 2023-03-28 |
| SOT8076-1_118 | HWQFN16; Reel pack for SMD; 13"; Q1/T1 product orientation | Packing information | 2023-04-03 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| NEH2000BY | Energy harvesting PMIC |
|