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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

BAS21LS

High-speed switching diode

High-speed switching diode, encapsulated in a leadless ultra small DFN1006BD-2 (SOD882BD) Surface-Mounted Device (SMD) plastic package with side-wettable flanks.

Features and benefits

  • High switching speed: trr ≤ 50 ns
  • Low leakage current
  • High reverse voltage VR ≤ 200 V
  • Low capacitance: Cd ≤ 2 pF
  • Ultra small and leadless SMD plastic package
  • Suitable for Automatic Optical Inspection (AOI) of solder joint

Applications

  • High-speed switching
  • General-purpose switching
  • Voltage clamping
  • Reverse polarity protection

參數(shù)類型

型號(hào) Package version Package name Size (mm) VR [max] (V) IFSM [max] (A) VF [max] (mV) IR [max] (nA) IFRM (mA) Configuration trr [max] (ns) IF [max] (mA) Cd [max] (pF) Automotive qualified
BAS21LS SOD882BD DFN1006BD-2 1 x 0.6 x 0.47 200 9 1250@IF=200mA 100@VR=200V 900 single 50 250 2 N

封裝

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
BAS21LS BAS21LSYL
(934661544315)		 Withdrawn / End-of-life M9 SOD882BD
DFN1006BD-2
(SOD882BD) 		SOD882BD REFLOW_BG-BD-1
SOD882BD_315

環(huán)境信息

下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。

型號(hào) 可訂購(gòu)的器件編號(hào) 化學(xué)成分 RoHS RHF指示符
BAS21LS BAS21LSYL BAS21LS rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (10)

文件名稱 標(biāo)題 類型 日期
BAS21LS High-speed switching diode Data sheet 2021-10-07
AN90023 Thermal performance of DFN packages Application note 2020-11-23
AN90023_ZH Thermal performance of DFN packages Application note 2021-02-26
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧輕便的汽車 二極管和晶體管 Brochure 2022-04-26
SOD882BD 3D model for products with SOD882BD package Design support 2023-02-02
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
SOD882BD Leadless ultra small plastic package with side-wettable flanks (SWF); 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.47 mm body Package information 2022-05-20
BAS21LS_Nexperia_Product_Reliability BAS21LS Nexperia Product Reliability Quality document 2022-03-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
BAS21LS BAS21LS SPICE model SPICE model 2024-10-14

支持

如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。

模型

文件名稱 標(biāo)題 類型 日期
BAS21LS BAS21LS SPICE model SPICE model 2024-10-14
SOD882BD 3D model for products with SOD882BD package Design support 2023-02-02

訂購(gòu)、定價(jià)與供貨

型號(hào) Orderable part number Ordering code (12NC) 狀態(tài) 包裝 Packing Quantity 在線購(gòu)買

樣品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.