可訂購部件
型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
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74HC574PW-Q100 | 74HC574PW-Q100,118 | 935298938118 | SOT360-1 | 訂單產(chǎn)品 |
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Click here for more informationOctal D-type flip-flop; positive edge-trigger; 3-state
The 74HC574-Q100; 74HCT574-Q100 is an 8-bit positive-edge triggered D-type flip-flop with 3?-?state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high?-?impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
Input levels:
For 74HC574-Q100: CMOS level
For 74HCT574-Q100: TTL level
3-state non-inverting outputs for bus oriented applications
8-bit positive, edge-triggered register
Common 3-state output enable input
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
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74HC574PW-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 14 | 133 | low | -40~125 | TSSOP20 |
Model Name | 描述 |
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型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
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74HC574PW-Q100 | 74HC574PW-Q100,118 (935298938118) |
Active | HC574 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
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SOT360-1_118 |
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
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74HC574PW-Q100 | 74HC574PW-Q100,118 | 74HC574PW-Q100 |
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74HC_HCT574_Q100 | Octal D-type flip-flop; positive edge-trigger; 3-state | Data sheet | 2024-08-05 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
SOT360-1_118 | TSSOP20; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2023-08-30 |
74HC574PW-Q100_Nexperia_Product_Reliability | 74HC574PW-Q100 Nexperia Product Reliability | Quality document | 2024-06-16 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
如果您需要設計/技術(shù)支持,請告知我們并填寫 應答表 我們會盡快回復您。
文件名稱 | 標題 | 類型 | 日期 |
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SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
Model Name | 描述 |
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型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
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74HC574PW-Q100 | 74HC574PW-Q100,118 | 935298938118 | Active | SOT360-1_118 | 2,500 | 訂單產(chǎn)品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.